Wednesday, September 30, 2009
The 100% solid, B-stage adhesive-preform provides a high bond
strength, no-mess solution to electronic assembly and other
industrial bonding and sealing operations. An attractive
characteristic of the FL901AO epoxy preform is its ability to cure
quickly at quite moderate temperatures, e.g. 1 hour at 250°F
(125°C) or 30-40 minutes at 300°F (150°C). Also,
squeeze out during bonding is almost non-existent. While FL901AO
exhibits a thermal conductivity on a level of 10
BTU•in/ft²hr°F, it is highly electrically insulating,
with volume resistivity exceeding 10x1012 ohm-cm. The
properties of FL901AO are substantially maintained over a wide
temperature range from -100°F to 400°F and upon prolonged
exposure to harsh environmental conditions such as moisture, heat
and other chemicals. It also features outstanding resistance to
thermal shock, vibration and impact.
Master Bond's FL901AO film preform is available in a range of
film thicknesses and can be laser or die cut to the configuration
of any part. Master Bond also offers the extra service of applying
the preformed epoxy film directly onto parts and then returning
them to the end user for assembly.
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